eDE Alliance has experienced Signal Integrity (SI) Analysis personnel ready to assist you in the design of complex high-speed electronic designs.
As PCB designs become more complex, with higher clock speeds, higher device switching speeds, and higher component densities, the need to analyze SI before prototype development is crucial for system timing, signal integrity and EMI / EMC concerns.
eDE Alliance signal integrity analysis is used to validate your design, signal topology and signal termination choices by applying digital and / or analog signal integrity stimulus. We can also make design suggestions that will ensure correct propagation and symmetry of high-speed signals between components through connectors.
Our analysis consists of both pre-layout and post-layout analysis ensuring optimal high-speed board layout and material selections.
Our expertise includes:
Signal Integrity Analysis for most types of board design including:
Signal Integrity Modeling, used for validating and ensuring correct signal integrity parameters, identifying and correcting design mistakes and ensuring correct layout parameters. These include:
- Impedance Matching
- Signal Timing Requirements
- EMI/EMC Analysis
- Bus Architecture and Topology Design
- Trace Separation Requirements
- Trace Flight Time Speeds
High speed design I/O modeling examples, including but not limited to:
- PCI, PCI-X, PCI Express
- SPI-3 and SPI-4
- Rapid I/O
- Processor Busses
- Memory Interfaces
- Switch Fabric